Microelectronics Product Line

Scanning Acoustic Microscopy, commonly referred to as SAM or SAT (Scanning Acoustic Tomography) is unparalleled in its ability to spot delaminations, cracks and other anomalies non-destructively. Not only does acoustic microscopy detect the failures but it also can provide the specific location of the problem. Sonix SAMs high resolution images and advanced diagnostic tools are used to:

• Diagnose device failures and discover failure "root causes"
• Monitor production sampling
• Qualify new package or production designs
• Research new materials or processes

The Sonix Advantage

The purchase of a Scanning Acoustic Microscope (SAM) is a major decision. A primary consideration in the purchase process is the system must be capable of producing the desired benefits for years to come. In a world of constant technological advances, knowing the "true" architecture of a product is the key to reducing obsolescence, allowing for cost-effective upgrades, and reducing down time through serviceability. Sonix utilizes state-of-the-art technology that ensures your investment meets current and future expectations. Below is a listing of our line of SAM systems currently available for a variety of semiconductor inspection needs.

Products

ECHO™	Sonix™ ECHO can detect defects as small as 0.05 micron and is an excellent tool for bump detection, stacked die (3D Packaging) inspection, complex flipchip inspection and more traditional plastic packages.
Fusion 3600™	Combines the best features of the long-standing benchmark HS1000, UHR-2001, and Q350 products into a single Scanning Acoustic Microscope platform updated with the latest production grade components.
Vision™	Advanced Acoustic Microscopy for stacked die Flip Chips and Bumped Die. - Failure Analysis - Reliability testing - Packaging - Process control.
HT3000™	The HT3000 is a SAM tool designed for the needs of production fl oor inspection. It allows for high throughput and automatic handling for either a vertical magazine of trays / boats placed into the system, or trays / boats from a handler fed in through a SMEEMA interface. Each tray / boat is loaded, debubbled, scanned, dried, and unloaded in sequence.
AW3000™	A fully-automated SAM system devoted exclusively for automated, high throughput inspection of wafer substrates, and die bonded to single silicon wafers. Engineered for high throughput, high resolution imaging in a production or process control environment.
Reconditioned Systems	Occasionally Sonix™ has reconditioned or demo equipment available. These systems carry a full system warranty and many can be upgraded to the latest hardware and software if necessary. Call your local Sonix™ representative for more information or check for system availability.

Discontinued Products

Fusion™	Combines the best features of the long-standing benchmark HS1000, UHR-2001, and Q350 products into a single Scanning Acoustic Microscope platform updated with the latest production grade components.
Vision™	Advanced Acoustic Microscopy for stacked die Flip Chips and Bumped Die. - Failure Analysis - Reliability testing - Packaging - Process control.
UHR2001™	Provides ultra-high resolution imaging. Ideal for general laboratory use, where small volume inspections needs are required. Specifically designed for flip chip or CSP inspections where high resolutions are needed, but can inspect all varieties of semiconductor devices.
HS1000™	Ideal for a laboratory setting. The HS1000 provides high resolutions for general, all-purpose IC inspections. Includes a large scan area for board mounted inspections and provides room for scanning components mounted on dual-JEDEC trays.
HS3600™	Just like our HS1000 system, however with an expanded 36"x24" scan area. This system has been ideal for customers inspecting components mounted on large boards, sheets of materials or general purposes uses.
UHR-Wafer™	An ultra-high resolution system engineered exclusively for wafer inspection. Similar to a UHR2001 system but with custom designed hardware and software features for laboratory wafer inspections.
Auto-Wafer™	A fully-automated SAM system devoted exclusively for automated, high throughput inspection of wafers. Engineered for high throughput, high resolution imaging in a production or process control environment.
Custom Systems	Sonix has custom designed a number of systems to meet a particular inspection need. In some cases a simplified or fully automatic inspections are needed. Call your local Sonix representative for more specific information.
Reconditioned Systems	Occasionally Sonix has reconditioned or demo equipment available. These systems carry a full system warranty and can be upgraded to the latest hardware and software if necessary. Call your local Sonix representative for more information or check for system availability.

System Options

Few customers have the same inspection needs. Sonix offers a variety of hardware and software options to tailor the system for your exact inspection needs.

• Hardware Options
• Software Options

Das Verfahren:

In Luft oder anderen durchsichtigen Stoffen sind wir es gewöhnt, mit dem optischen Mikroskop zu arbeiten. Schallwellen werden in Luft und in Gasen stark gedämpft, ihre Reichweite ist gering. In Festkörpern und Flüssigkeiten können sie jedoch eindringen, auch wenn sie optisch undurchsichtig sind. Schallwellen besitzen hier gegenüber Lichtwellen einen großen Vorteil. Mit dem akustischen Mikroskop werden Objekte deutlich, die sich durch elastische Eigenschaften und verschiedene Schallgeschwindigkeiten unterscheiden. Beim Ultraschall ermöglicht der an Grenzflächen unterschiedlicher akustischer Impedanz reflektierte Schall den Aufbau eines Bildes. Lichtmikroskop und Ultraschallmikroskop sind keine Konkurrenten, sondern ergänzen einander. Vorteilhaft einsetzbar sind akustische Mikroskope (Ultraschallmikroskope) in der biologischen und medizinischen Forschung. Viele Strukturen lebender Zellen haben Abmessungen im Mikrometerbereich. Kleine Strukturelemente unterscheiden sich häufig stark in ihren elastischen Eigenschaften. Da die Proben in Wasser eingebettet sind und weder getrocknet noch angefärbt oder dem Vakuum ausgesetzt werden müssen, ist die Untersuchung am lebenden Material möglich. Besonders gut geeignet sind akustische Mikroskope auch in der Elektronik, z.B. bei der Untersuchung mikroelektronischer Schaltkreise. Die gewonnen akustischen Bilder sind kontrastreicher als optische Aufnahmen. Als weitere Einsatzmöglichkeit seien genannt die zerstörungsfreie Werkstoffprüfung, die Prüfung von Metalloberflächen und die Untersuchung von Festkörpern auf verschiedene Zustände.