The substrate (PCB/chip-carrier/silicon/etc.) is literally the foundation upon which over 90% of value-added processing is performed in the microelectronics supply chain. Substrate flatness compliance is being driven by first pass yield objectives and uncompromising product reliability. Leading OEMs and contract manufacturers are achieving these objectives by introducing local area flatness specifications to compliment traditional IPC bow and twist allowances. Together, Akrometrix and its industry partners have successfully validated the importance of substrate flatness.

Akrometrix' LineMoiré product line enables manufacturers to cost effectively measure, analyze and react to board-to-board and lot-to-lot variations in substrate flatness. Whether in a stand-alone or in a high volume application, manufacturers receive real-time data to make substrate specific decisions (pass/fail), monitor trending (SPC), identify key correlations between flatness and assembly defects and enable traceability. All of these capabilities empower engineers and managers to better understand processes and materials, improve first pass yields and provide a definitive competitive advantage in the marketplace.

• Fast; less than 1.0 second data acquisition, no added cycle time to even the fastest of lines
• Accurate; +/- 2.5 micron sensitivity or better
• Scalable; up to 25" x 28" measurement areas
• Flexible; stand alone or in-line
• Small Footprint; 1m x 1m or can replace feeder conveyor at front of flow line
• Easy to use; 15 minute operator setup; 5 minute product changeover

All of the above combined provide users with a low cost per test and a clear ROI.

Availible Systems: